| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a reliable composite circuit substrate for securing electrical connections by improved solder bump junction, without adding flux constituents. SOLUTION: A resin layer 3, containing epoxy resin and a phenol curing agent, is formed on the wiring surface of a first circuit substrate 1 formed on a solder bump electrode 2, a second circuit substrate 5 where a solder bump electrode 6 is formed is laminated on the resin layer 3, and the wiring surface of the first circuit substrate 1 and that of the second circuit substrate 5 are sealed with resin, and at the same time, are electrically connected via the solder bump electrodes 2 and 6.
|
