SUBSTRATE FOR USE IN MOUNTING COMPONENTS, ELECTRONIC COMPONENT DEVICE AND METHODE FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a substrate for use in mounting components, an electronic component device and a method for manufacturing the same that can be configured as a thin type electronic component suitable for an electronic component being assembled in thin type electronic equipment by maintaining conventional electric characteristics and can reduce electromagnetic waves which is going to radiate in circumscription. SOLUTION: In a substrate 10 for use in mounting components of this invention, wiring circuit electrode portions 12 are formed with a metal plating layer and a surface of the metal plating layer is covered with an electric insulation resin film layer 13 and furthermore its surface is covered with an electromagnetic wave absorption layer 14. In a semiconductor device 20 of this invention, an IC chip is mounted on another surface of the wiring circuit electrode portion 12 of such substrate for mounting the components and an encapsulation insulation resin 24 seals the entire, mainly the IC chip 21.