发明名称 CERAMIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a ceramics circuit board where insulation between adjoining metal circuit boards is assured for stable and reliable operation. SOLUTION: A ceramics circuit board is provided where a plurality of metal circuit boards 3 are fitted to the upper surface of a ceramics substrate 1. Here, a voltage applied to the plurality of metal circuit boards 3 is 400 V or higher, a distance between the adjoining metal circuit boards 3 is 1.5 mm or less, and a curvature radius of an upper peripheral corner 3a of the metal circuit board 3 is 0.05 mm or larger to form an arc.
申请公布号 JP2002232090(A) 申请公布日期 2002.08.16
申请号 JP20010022245 申请日期 2001.01.30
申请人 KYOCERA CORP 发明人 OTOMARU HIDEKAZU
分类号 H05K1/02;H05K3/20;(IPC1-7):H05K1/02 主分类号 H05K1/02
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