| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method of a multilayer printed circuit board for performing surface treatment rapidly and effectively. SOLUTION: In the treatment method, corona discharge is applied from first and second electrodes 21 and 23 to the hole formation surface of a substrate 100. Corona discharge, applied from the first and second electrodes 21 and 23, is concentrated to a conductive layer 102 exposed at a hole 104, thus removing smear 105 remaining in the hole 104. Also, a portion of corona discharge is applied to the entire hole formation surface, thus making the hole forming surface hydrophilic. By the treatment method, first and second dielectrics 22 and 24 covering the first and second electrodes 21 and 23, respectively, function as a minute capacitor aggregate, thus rapidly and effectively performing surface treatment, without damaging the hole forming surface or the like. |
