| 摘要 |
PROBLEM TO BE SOLVED: To provide high reliability and simplify processes. SOLUTION: The IC module is provided with a substrate 121, an IC chip 125 of a contact-cum-non-contact type mounted on a rear face of the substrate 121, a terminal 124B for contact formed on a surface of the substrate 121, an antenna 124A for non-contact communication formed on the surface of the substrate 121, through-holes 121a formed in positions of the substrate 121 corresponding to connection terminal parts of the terminal 124B for contact and the antenna 124A for non-contact communication, bonding wire 126 (126B and 126A) used as a connection means directly connecting a connection terminal part of the IC chip 125 to the connection terminal parts of the terminal 124B for contact and the antenna 124A for non-contact communication through the through-holes 121a of the substrate 121, and a sealing material 127 sealing the backside of the substrate 121 by resin. |
