| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve accuracy in the fault detection of a semiconductor processing tool. SOLUTION: One technique is the grouping of sensors, wherein a fault detection index is calculated from a group of tool operation parameters that correlate with one another. Another technique is the ranking of sensors, wherein the sensors are accorded with different weights for calculating the fault detection index. Improved accuracy in fault detection can be accomplished by employing a variety of sensor types to predict the behavior of the semiconductor processing tool. Examples of such sensor types include active sensors, cluster sensors, passive/inclusive sensors, and synthetic sensors.</p> |
