| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device storing board capable of suppressing damage due to thermal stress caused by differential thermal expansion of a cover and an insulation board. SOLUTION: The semiconductor device storing board is provided with the insulation board 2, a semiconductor device 7 stored in the cavity of the upper face of the insulation board 2, the cover 11 bonded on the upper face of the insulation board and sealing the semiconductor device 7, and a plurality of terminal electrodes 13 formed on the bottom face of the insulation board 2 and releasing electric conduction by an insulation groove 15. The plurality of the terminal electrodes 13 are drawn out to the side of the insulation board 2, and the insulation groove 15 is formed on the side of the insulation board 2.</p> |
