| 摘要 |
PROBLEM TO BE SOLVED: To provide a high power semiconductor module having high reliability of a crimped module capable of employing a cooling device in which industrial water flows. SOLUTION: A first electrical contact is established by a number of thin semiconductor chips (14) arranged on and containing with a lower surface of a base plate (11) and a second electrical contact is established by a cover plate (13) arranged in parallel with the base plate (11) and adding pressure force to an upper surface. In such a module, each of the base plate (11) surfaces or outside surfaces and the cover plate (13) not facing to the semiconductor chips (14) is electrically isolated from the semiconductor chips. Consequently, it is possible to simplify the cooling system. |
