发明名称 |
ASSEMBLING METHOD OF PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To provide the assembling method of a package capable of surely assembling the small-sized package without lowering yield. SOLUTION: An adhesive is applied on an electrode to attach a crystal vibrator on a base. A cover is overlapped on the base in an inert gas atmosphere. The base is heated with a heater. The cover is pressurized toward the base to impart ultrasonic vibration to the cover. The cover and the base are fixed.
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申请公布号 |
JP2002231838(A) |
申请公布日期 |
2002.08.16 |
申请号 |
JP20010021744 |
申请日期 |
2001.01.30 |
申请人 |
PIONEER ELECTRONIC CORP;PIONEER FA:KK |
发明人 |
CHIBA NOBORU;KOSAKA HIROYUKI |
分类号 |
H01L23/02;H03H3/02;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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