发明名称 ASSEMBLING METHOD OF PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide the assembling method of a package capable of surely assembling the small-sized package without lowering yield. SOLUTION: An adhesive is applied on an electrode to attach a crystal vibrator on a base. A cover is overlapped on the base in an inert gas atmosphere. The base is heated with a heater. The cover is pressurized toward the base to impart ultrasonic vibration to the cover. The cover and the base are fixed.
申请公布号 JP2002231838(A) 申请公布日期 2002.08.16
申请号 JP20010021744 申请日期 2001.01.30
申请人 PIONEER ELECTRONIC CORP;PIONEER FA:KK 发明人 CHIBA NOBORU;KOSAKA HIROYUKI
分类号 H01L23/02;H03H3/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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