| 摘要 |
PROBLEM TO BE SOLVED: To test a wafer using a prober in a short time. SOLUTION: A memory/logic inspecting probe card 22 is mounted to a prober 25, and is provided with a memory inspecting probe needle 22a for giving and receiving a memory inspection signal by coming into contact with an electrode of a memory circuit of one semiconductor chip formed adjacent on a wafer 3, and a logic inspecting prove needle 22b for giving and receiving a logic inspection signal by coming into contact with the electrode of a logic circuit of the other semiconductor chip 3a. Further, there is provided a laser irradiator 23 for irradiating a laser to the semiconductor chip 3a for taking a step of repairing by transmitting a laser irradiation hole 22c provided in the memory/ logic inspecting probe card 22.
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