发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste with small warping deformation generated when manufacturing a base board parts having an electrode film formed by printing the conductive paste on the surface of a glass ceramic, and making the electrode film adhere with high adhesion strength. SOLUTION: The conductive paste of which, the main component is made by the mixed powder of two or more kinds of Ag/Pd alloy powders with different content ratio of Pd from each other, or made by the mixed powder of Ag/Pd alloy powder and Ag powder, is composed.
申请公布号 JP2002231049(A) 申请公布日期 2002.08.16
申请号 JP20010020769 申请日期 2001.01.29
申请人 DAIDO STEEL CO LTD 发明人 KITAMURA YOICHIRO;WATANABE SHIN;KAWANOBU YASUTAKA
分类号 H05K3/12;H01B1/00;H01B1/22;H01L23/14;(IPC1-7):H01B1/22 主分类号 H05K3/12
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