发明名称 ELECTRODE MATERIAL FOR FORMING STAMPER AND THIN FILM FOR FORMING STAMPER
摘要 PROBLEM TO BE SOLVED: To provide an electrode material for forming a stamper constituted to suppress the damage of a thin film for forming the stamper and to enhance the quality of the stamper to be formed by improving corrosion resistance and the thin film for forming the stamper. SOLUTION: The electrode material for forming the stamper contains silver (Ag) as an essential component and contains at least one kind of other elements. The other elements are preferably at least one kind of either of gold (Au) and cooper (Cu). Further, <=5.0 wt.% both of Au and Cu elements of these elements are more preferably incorporated therein. The thin film for forming the stamper is composed of the electrode material for forming the stamper.
申请公布号 JP2002230850(A) 申请公布日期 2002.08.16
申请号 JP20010028456 申请日期 2001.02.05
申请人 PIONEER ELECTRONIC CORP;FURUYA KINZOKU:KK 发明人 KATSUMURA MASAHIRO;IIDA TETSUYA;UENO TAKASHI;ODA NOBUHIRO
分类号 B29C33/38;C22C5/06;C22C5/08;C23C14/14;C23C14/58;C25D1/00;G11B7/26;(IPC1-7):G11B7/26 主分类号 B29C33/38
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