| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the occurrence of a corrosion of a conductor on a board in a cleaning step, after chemical and mechanical polishing. SOLUTION: A method for chemical and mechanical polishing comprises the steps of preparing chemical and mechanical polishing materials 2, 5 containing an oxidizing agent on the surface of a rotatable polishing surface platen 1, disposing the conductor on a board held on a rotatable or slidable polishing holding base 4 on the surface of the platen 1, contacting the conductor with the chemical and mechanical polishing material, polishing, and treating the surface to be polished of the conductor on the board, after polishing with an aqueous solution 6 containing a reducing agent. Thus, after the chemical and mechanical polishing, abrasives and the solution in the polishing material retained on the surface to be polished of the conductor on the board and the oxidizing agent contained in the solution can be physically and chemically vanished or removed, and the corrosion of the conductor on the board can be suppressed.</p> |
