| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cutting a semiconductor wafer capable of surely cutting and isolating the wafer, without bringing about sagging of films, when the wafer is cut by a rotary blade. SOLUTION: The method for cutting the semiconductor wafer comprises the steps of holding the semiconductor wafer 1 laminated with a metal film 3 of aluminum or the like on the rear surface of a semiconductor layer 2 of a silicon or the like at a thin plate-like sheet material 4 by means of coating or the like, mounting the wafer on the chuck table of a cutter A, first cutting most of the layer 2 by a first time feeding operation when the wafer is cut along a prescribed cutting line by a rotary blade 5, and cutting its entirety, including the metal film 3 by a second feeding operation. Thereby, a load to be applied to a cutting edge of the rotary blade 5 or tension to be applied to the metal film, when the film 3 is cut are alleviated, and the metal film is surely cut and disconnected without difficulty. |
