| 摘要 |
PROBLEM TO BE SOLVED: To retain improved solder connection and the mechanical strength of a resin substrate by desirably controlling a connection interface temperature, when connecting a flexible printed-wiring board to a ridged printed circuit board. SOLUTION: The board connection method for simultaneously performing resin adhesion and solder junction on a resin substrate, has at least a wiring pattern on the surface by heating and pressing the second resin substrate having a wiring pattern on the surface, using a thermocompression tool. The substrate section, where the resin adhesion and solder junction are made is heated and pressed by the thermocompression tool, and at the same time, cooling is done using a cooling medium such as an air nozzle locally by taking into consideration the distribution of the connection interface temperature, based on the roughness and concentration of the surface and/or internal wiring pattern of the substrate. |
