| 摘要 |
PROBLEM TO BE SOLVED: To provide coating film treatment equipment and a coating film treatment method wherein treatment gas having a prescribed composition can be supplied stably to a treatment chamber for treatment a coating film. SOLUTION: An SOD system is one embodiment of coating film treatment equipment and forms an interlayer insulating film on a surface of a semiconductor wafer W. The system is provided with a chamber 61 in which a semiconductor wafer W is accommodated, a first gas supplying mechanism which supplies ammonia gas in the chamber 61 while flow rate of the ammonia gas is controlled by a mass flow controller (MFC) 37, and a second gas supplying mechanism which supplies nitrogen gas containing steam of a prescribed concentration in the chamber 61 while flow rate of the nitrogen gas is controlled by a mass flow controller (MFC) 38. As a result, treatment gas having a specified composition can be supplied stably in the chamber 61.
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