INSULATION BOARD WITH HEAT SINK, BONDING MEMBER AND BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an insulation board with a heat sink capable of setting the temperature state of a bonded part low in a state that pushing force for mutually pushing them is small when a board body side and the heat sink are mutually bonded. SOLUTION: The second metal surface layer 14 of the board body 12 and a heat sink 15 are joined by diffused junction. The heat sink 15 is composed of a composite material formed in higher hardness than the second metal surface layer 14 by a matrix phase consisting of aluminum alloy and a dispersion phase consisting of SiC particles. A protrusion 17 is formed on the opposite face 16 of the heat sink 15, and bites into the second metal surface layer 14 in the state that the side f the board body 12 and the heat sink 15 are diffused and bonded.