| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase the mounting density of electronic component by mounting an electronic component, even at a part which is other than the surface of outer layer patterns. SOLUTION: An SMD 22 is contained in a cut part 21, recessed from the outside of the body of a board 11 and connected with inner layer patterns 2 and 3 utilizing contact pads 24. Since the SMD 22 can be mounted at a part which is other than the surface of outer layer patterns 6 and 7, mounting density of the component can be increased.</p> |
