| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method capable of being packaged by a chip area without using a semiconductor manufacturing process, enhancing mounting reliability, and improving a degree of freedom of re-wiring. SOLUTION: A semiconductor chip 42 is stuck on a mold releasing body forming a recess-like pattern filling a conductive paste, the conductive paste 44 wired on a circuit face 42a to the circuit face 42a of the semiconductor chip 42 is transferred by embedding a metal protrusion 43 in the conductive paste, and the circuit face 42a and the conductive paste body 44 are sealed by a sealing resin. Thereafter, the surface of the sealing resin is ground until the top part (one end) 44a of the conductive paste body is exposed to constitute a resin layer 45. |
