| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting method capable of enhancing mounting efficiency. SOLUTION: In an electronic component mounting method, electronic components are picked up from a component supplier by a transfer head of a multi-type to be mounted to a board. In one mounting turn, in which the transfer head mounts a plurality of electronic components to the board, when incidental components to be mounted are decided together with a designated component instructed in advance by a mounting sequence, if pickup priority to be set based on conditions about pickup operations in the component supplier is identical, the accompanying component is decided according to the transfer mounting priority to be set, based on a proximity degree in terms of a distance of the designated component and the accompanying component on the board. Thus, mounting efficiency is enhanced by excluding wasteful movement of the transfer head on the board. |
