| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device storing package capable of normally operating a semiconductor device stored in the inside without producing an unnecessary electric short circuit and electric insulation failure between a lead terminal and a sealing metalized layer. SOLUTION: In the semiconductor device storing package bonding the lead terminal 2 through a brazing material 7 on the metalized wiring conductor 5 of an insulation substrate 1 having the sealing metalized layer 8 adhered so as to surround a recess 1a on the metalized wiring conductor 5 and the lower face derived from the inside of the recess 1a for storing the semiconductor device 4 formed on the lower face to the side, the insulation substrate 1 forms a notch part 1b having the upper face and the side on the lower end of a part joining the lead terminal 2, and a metalized metal layer 10 joining the brazing material 7 is adhered on the upper face of the notch part 1b.</p> |
