| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a three-dimensional mounting structure having a mounting density and is low in cost. SOLUTION: The three-dimensional mounting structure comprises a support 1, having a wiring structure formed of a metal conductor and an insulating resin layer on at least any one of front and rear surfaces; at least one conductive passage penetrating the front and rear surfaces; a first electronic component 3 made of a component having at least any one of electrodes formed at least on any of the front and rear surfaces, connected to at least one of the conductors on the support with at least one of the passage of the component and the electrodes, and built into the support; and second electronic components 12 mounted at least at one of the electrodes of the conductor formed on at least any of the uppermost surfaces of the wiring structure formed on the support.</p> |
