发明名称 CERAMIC MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To prevent a projection being extended from the surface of one or a plurality of circuit elements from being formed in a ceramic multilayer wiring board, by printing one or a plurality of circuit element patterns onto the surface of a green sheet 20, that is formed by using a ceramics mixed material containing ceramic powder 2 and a binder resin, by using a conductor mixed material containing conductor powder 3 and the binder resin, composing a laminate by overlapping a plurality of green sheets 20 where one or pluralities of circuit element patterns are printed, and compressing and burning the laminate. SOLUTION: In the ceramic multilayer wiring board, an average particle diameter of the ceramics powder 2 is set to Rs, that of the conductor particle is set to Rd, and the standard deviation, if the distribution of the particle diameter of the conductor powder 3 is expressed by a normal distribution function, is set toσd, and the value of Rs is equal to or less than the value of (Rd-σd).</p>
申请公布号 JP2002232140(A) 申请公布日期 2002.08.16
申请号 JP20010364297 申请日期 2001.11.29
申请人 SANYO ELECTRIC CO LTD;SANYO ELECTRONIC COMPONENTS CO LTD 发明人 OGURA TAKASHI;HORIMOTO SHIGEHIRO;HONGO MASAKI
分类号 H05K3/46;H01L23/12;(IPC1-7):H05K3/46 主分类号 H05K3/46
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