发明名称 MULTI-PIECE SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a multi-piece substrate and manufacturing method thereof, where, even if pieces are patched, a patched part is flash with other pieces and strength at a joint part is prevented from degrading. SOLUTION: Related to a mixed board containing a defective piece and a nondefective piece where an outermost layer pattern is not formed, a bridge 8 is provided with a cut line, and the cut lines are jointed together with an adhesive. Then an upper layer is further laminated to provide a multi-piece substrate 1 which contains only nondefective pieces. Although a joint line 9 is present at the bridge 8, the joint line 9 is well jointed using the adhesive and further is well covered with the upper layer. So, degradation of the strength of the bridge 8 due to patching is prevented. Thus, such multi-piece substrate is provided together with its manufacturing method, as no patched piece 3 accidentally drops at handling in a post process.
申请公布号 JP2002232089(A) 申请公布日期 2002.08.16
申请号 JP20010021415 申请日期 2001.01.30
申请人 IBIDEN DENSHI KOGYO KK;IBIDEN CO LTD 发明人 YANASE MAKOTO;KOSAKA KATSUMI
分类号 H05K1/02;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K1/02
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