| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a heat sink capable of securing a production quantity without increasing a facility for bonding a board and fins even when the thickness of the board is thick, in addition, hardly annealing the whole fin during bonding, thus hardly producing deformation on the fins. SOLUTION: The trough bottom part 32 of the cross section waveform fin 3 is arranged on the upper face of the board 2, and soldered on the upper face of the board 2 by submerging the board 2, the trough bottom part 32 of the fin 3 and the neighborhood thereof in a melting solder bath S in this state.
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