发明名称 CONDUCTIVE RESIN COMPONENT, AND MOLDING PRODUCT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin composition and its molded product with high conductivity, moldability (fluidity at molding), and high grade outlook, and to provide a molding product using the same. SOLUTION: The conductive resin is composed of at least following constituents [A], [B] and [C], and the constituent [A] fulfils at least following conditions (A1), and/or (A2). [A]: discontinuous fibrous or needle-shaped graphite filler [B]: conductive fiber, [C]: resin. (A1): The Raman scattering strength ratio I2/I1 be less than 0.3. (A2): The Raman scattering strength ratio I2/I3 be less than 0.3. Here, I1: local maximum of the Raman scattering strength appearing in the vicinity of the Raman shift 1360 cm-1, I2: local minimum of the Raman scattering strength appearing in the vicinity of the Raman shift 1480 cm-1, I3: local maximum of the Raman scattering strength appearing in the vicinity of the Raman shift 1580 cm-1. The molding material and the molding product are formed by processing or molding above conductive resin component.
申请公布号 JP2002231051(A) 申请公布日期 2002.08.16
申请号 JP20010028180 申请日期 2001.02.05
申请人 TORAY IND INC 发明人 WADAHARA EISUKE;ISHIBASHI SOICHI;YOSHIOKA KENICHI
分类号 C08J5/00;C08K3/04;C08K3/32;C08K7/06;C08L71/12;C08L101/00;H01B1/24;H05K9/00;(IPC1-7):H01B1/24 主分类号 C08J5/00
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