SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To seal a semiconductor element and a conductive material more perfectly compared to a conventional semiconductor device and also to secure a terminal member more tightly. SOLUTION: The semiconductor device comprises a semiconductor element 1, an external terminal 3 arranged at a predetermined spacing distance from the semiconductor element 1, gold wires 5 conducting the semiconductor element 1 and the external terminal 3 and a molding resin 7 covering at least a part of the external terminal 3 and encapsulating the semiconductor element 1 and the gold wires 5 wherein a concave-shaped groove portion 11 is arranged in a groove forming area 15 of the external terminal 3 and the concave-shaped groove portion 11 is filled with the molding resin 7. A contact area between the molding resin 7 and the external terminal 3 increases and the mold resin 7 is sandwiched by a side wall of the concave-shaped groove portion.