| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining method between a flexible board 1 and a hard substrate 11, which forms a mechanically reinforcing part at a low cost with less weight and small size. SOLUTION: Related to a flexible wiring board 1 where an electric circuit wiring conductor 5 is formed, a plurality of through holes 3, 7, and 8 electrically independent of the circuit wiring 5 are provided. A cream solder 4a is used to solder the flexible substrate 1 to the hard substrate 11 so that the solder 4a is formed into a rivet shape due to the through holes 3, 7, and 8 and a surface land 3a of the substrate.
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