发明名称 CIRCUIT BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a circuit board capable of effectively preventing the corrosion of the conductor layer and the short-circuiting between the adjacent conductor layers and having high reliability. SOLUTION: The circuit board comprises a plurality of the conductor layers 3 and plating lead layers 3a which extend from the layers 3 to an outer periphery of the board 1 of a conductor material containing silver on an upper surface of the board 1, and a plating layer 4, made of at least one type selected from the group consisting of nickel and gold on the upper surface of the layers 3 and the plated lead layer 3a. The layer 4 is set in thickness to 10% or more of that of the layer 3, and its part is extended and formed at its end up to the final end face, so as to coat the final end face of the layer 3a disposed on the outer periphery of the board.
申请公布号 JP2002232118(A) 申请公布日期 2002.08.16
申请号 JP20010022522 申请日期 2001.01.30
申请人 KYOCERA CORP 发明人 SHIGETA YASUHIKO
分类号 C25D7/00;H05K3/00;H05K3/18;H05K3/24;(IPC1-7):H05K3/24 主分类号 C25D7/00
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