摘要 |
PROBLEM TO BE SOLVED: To provide a new configuration for a surface acoustic wave device, which can make a circuit including a surface acoustic wave element and a circuit element small in size and also improve the circuit function. SOLUTION: The surface acoustic wave element 120 including a piezoelectric material layer 121, interdigital electrodes 122 and 123 and reflectors 124 and 125 is formed on the surface of a dielectric board 110, and an inductor L, a variable capacitor Cv and a capacitor CL formed by a micromachine process are arranged at positions away from the effective propagation area A of the surface acoustic wave element 120.
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