| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste with excellent conductivity and fill up property to a through hole or non-through hole of a builtup multilayer wiring board. SOLUTION: For the conductive paste, containing a binder and conductive powder, with a specific gravity of 3-7.5, the mixing ratio of the binder:the conductive powder in volume, to the solid portion of the conductive paste, is 35:65-65:35, and the main components of the binder are alkoxy group containing resol type phenol resin, liquid epoxy resin, and their curing agent.
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