| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED array where a wafer substrate is not cracked or chipped, light emitting precision is improved and light emission has high density. SOLUTION: A dicing groove 13 is formed on the surface of the wafer substrate 11 and a notch 21 is formed at the back by etching. A dicing blade 24 is cut in the dicing groove 13. Then, the long substrate is removed from a base material 22 and the LED array is obtained. |
