| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable mounting method for an IC chip. SOLUTION: A thermoplastic resin film 30 provided with through-holes 31 on positions corresponding to bumps 13-15, 22 and 23 is arranged between a printed wiring board 10 provided with the bumps 13-15 and the IC chip 20 provided with the bumps 22 and 23. After performing heating/pressurizing, the bumps 13-15 of the printed wiring board 10 and the bumps 22 and 23 of the IC chip 20 are bonded, also the film 30 is fused, and the IC chip 20 and the printed wiring board 10 is sealed with resin. A film 16 composed of a hydrocarbon compound whose C-H bonding dissociation energy is 950 J/mol or less is arranged on the surface of the bumps 13-15 of the printed wiring board 10, and heating and pressurizing operations are performed in the state of interposing the film 16 between the bumps and bump bonding and resin sealing. |
