METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device wherein a second semiconductor element is surely adhered on a first semiconductor element by improving a conventional method wherein it is necessary to attach the second semiconductor element under the condition that the first semiconductor element and a wiring board are warped because the second semiconductor element is attached on the first semiconductor element after the first semiconductor element is attached on the wiring board. SOLUTION: The first semiconductor element and the wiring board are attached using an adhesive 25 after the first semiconductor element 20 and the second semiconductor element 22 are attached using the adhesive 25. Subsequently electrodes of the first semiconductor element 20, electrodes of the second semiconductor element 22 and electrodes of the wiring board 26 are electrically connected with fine metal wires 27.