发明名称 MANUFACTURING METHOD OF ELECTRONIC PART AND MANUFACTURING DEVICE USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To solve the problem that since sealing is performed under atmospheric pressure in the conventional method melting and sealing an adhesion member by a light beam, during sealing, gas sealed in the inside of a package is swelled to increase inside pressure, the adhesion member is flied out to the outside, and becomes appearance inferiority. SOLUTION: A base member 1 and a cover 9 mounting an element 2 are put in a hermetically sealable container 11 at least one face of which comprises a translucent member, pressure is reduced, light is irradiated through the translucent member 10 from the outside of the hermetically sealable container 11, and an opening provided in one face of the base member 1 and the cover 9 are fixed and sealed.</p>
申请公布号 JP2002231839(A) 申请公布日期 2002.08.16
申请号 JP20010025219 申请日期 2001.02.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TANATSUGI EIJI;IWATA KAZUO;UCHIBORI KENICHI;KAKUMARU KIMIYA;HIROOKA TAISUKE
分类号 H01L23/02;H03H3/08;(IPC1-7):H01L23/02 主分类号 H01L23/02
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