| 摘要 |
PROBLEM TO BE SOLVED: To secure the junction property between conductor patterns in each via hole, when connecting a multilayer board where pluralities of layers where the conductor pattern is formed are laminated and at the same time the via hole for extracting the conductor pattern of each layer is formed, and a flexible board where the conductor pattern is formed on one surface side. SOLUTION: The connection method of a board comprises a process for forming a via hole on the multilayer board 10, so that the diameter of the via hole for extracting the conductor pattern 20 at a layer close to a surface 10a of the multilayer board 10 out of via holes 31-34 is larger than that of the via hole for extracting the conductor pattern 20, at a layer that is distant from the surface 10a; a process for forming a bump 70 on the conductor pattern 50 of the flexible board 40; and a process for melting the bump 70 for filling the via holes 31-34, and at the same time, connecting both the boards by heating and pressing both the boards 10 and 40 that are arranged facing opposite to each other. |
