发明名称 |
SURFACE ACOUSTIC WAVE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To drastically reduce the cost of a SAW filter by enhancing the judgment accuracy of acceptance very much at a wafer stage by enabling a high frequency probe to measure/select non-defective of the frequency characteristic of the SAW filter formed on a wafer while preventing comb-shaped electrode fingers from being subjected to discharge breakdown by pyroelectric effect due to rapid temperature fluctuation in a SAW filter producing process. SOLUTION: The relation between the total area of the formation region of a wire electrode and comb-shaped electrodes connected to the wire electrode and the inter-electrode finger distance of an IDT electrode meets the following expression. S <=1.49×105×√(Lidt-0.4) (however, S: total area (μm2) of wire electrode and comb-shaped electrode connected to wire electrode, and Lidt: inter-electrode finger distance (μm) of IDT electrode)).
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申请公布号 |
JP2002232254(A) |
申请公布日期 |
2002.08.16 |
申请号 |
JP20010023841 |
申请日期 |
2001.01.31 |
申请人 |
KYOCERA CORP |
发明人 |
FUNEMI MASAYUKI;YAMAGATA YOSHIFUMI |
分类号 |
H03H9/145;H03H3/08;H03H9/64;(IPC1-7):H03H9/145 |
主分类号 |
H03H9/145 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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