SEMICONDUCTOR IC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor IC device capable of increasing a total memory capacity and in addition a higher speed operation without accompanying a fine patterning technology which requires a large amount of cost for a capital investment and has a definite limitation naturally. SOLUTION: The semiconductor IC device comprises a micon chip 201 with embedded nonvolatile memory, a nonvolatile memory chip 202 and a volatile RAM chip 203 wherein the 3 chips are stacked on each other and electrodes of at least one of the nonvolatile memory chip 202 and the volatile RAM chip 203 are electrically connected to electrodes of the micon chip 201 with embedded nonvolatile memory and sealed into one packaged 214.