HEAT ANALYZING APPARATUS, HEATING CONDITION ARITHMETIC UNIT, HEAT ANALYSIS METHOD, HEATING CONDITION CALCULATION METHOD, AND PROGRAM FOR EXECUTING THE METHODS

摘要

PROBLEM TO BE SOLVED: To provide a heat analysis apparatus or the like for accurately and rapidly predicting the temperature of an object to be heated by easily introducing the form coefficient of the object to be heated, when determining heating conditions to be given to the heating apparatus of a reflow apparatus or the like. SOLUTION: Physical value data 121 and 122, regarding a surface-mounting circuit board that becomes the object to be heated, the setting temperature of a heater and a blower that become heating conditions to be given to the reflow apparatus, and form coefficient-setting data 124 and 125 for determining the form coefficient of the surface-mounting circuit board are inputted. The form coefficient is readily determined from the inputted data and heating characteristics data 150 characteristic of the reflow apparatus, such as the number of heaters and blowers, the thermal conductivity, a conveyor speed, and the like. At the same time, the temperature of the surface-mounting circuit board when passing through the reflow apparatus is calculated for the board and components mounted on the board, using the determined form coefficient.