| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a very flat substrate for a disk-shaped recording medium by reducing the warpage of a substrate during forming a thin and small-diameter substrate. SOLUTION: About a pad 44 which attracts the substrate 1 of the substrate takeout machine 60 which takes out the substrate 1 for a disk-shaped recording medium from a mold after injection molding, an outer peripheral side projecting part 44a and an inner peripheral side projecting part 44b which are brought into contact in the outer peripheral part and the inner peripheral part of the substrate 1, are provided concentrically. The substrate 1 is sucked arranging suction holes 44h at least in the outer peripheral sides projecting part 44a or the inner peripheral side projecting part 44b, and then applying a negative pressure to the suction holes 44h.
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