PRINTED CIRCUIT BOARD AND SOLDER-DEPOSITING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board that can form sufficient amount of solder on a conductor and can cope with a large current by taking into consideration the change in a solder-depositing process. SOLUTION: The printed circuit board 10 has a conductor 11, where plural lands 13 divided by resist 12 are formed and performs soldering to the land 13 by a flow-soldering apparatus 20. In the printed circuit board 10, the width in the land is made longer than the length in the land to the solder flow direction in the flow-soldering apparatus 20. The land 13 is 3-4 mm wide and 6-8 mm long and plural lands are formed. The resist 12 for demarcating the land 13 is 0.5-2 mm in width.