| 摘要 |
PROBLEM TO BE SOLVED: To keep the manufacturing environment clean for a semiconductor device and prevent contamination of a sealing body from a reactive products. SOLUTION: A sputter etching apparatus for carrying out sputter etching on a semiconductor substrate 1 and manufacturing of a semiconductor device includes an opening for carrying in and out the semiconductor device, a chamber 5 for storing the semiconductor substrate 1, a sealing body 7 for sealing the chamber 5 in vacuum, and a plasma jig mounting plate 13, having an outer circumferential wall 4o along the inner wall face of a cylindrical crystal 9 supported on the chamber side of the sealing body and provided along the inner wall face for shielding an oxide silicon particle. In the plasma jig mounting plate 13, the length from the inner face of the sealing body 7 to the inner face of the top part 15 of the outer circumferential wall 40 is longer than that from the inner face of the sealing body 7 to the inner face of the top part 15 of the plasma jig mounting plate 13. As a result, the path to the sealing body for the oxide silicon particle generated in the sputter treatment is elongated, as compared with the conventional case.
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