| 摘要 |
PROBLEM TO BE SOLVED: To provide insulating paste which has high adhesiveness to a resin substrate such as a polyimide substrate and high mounting reliability. SOLUTION: The insulating paste contains as an essential component (A) a liquid epoxy resin, (B) a curing agent for the epoxy resin, (C) silica powder, and (D) organophosphoric ester represented by the general formula: [wherein, n represents an integer of 0 or 1 to 3; a represents an integer of 1 to 3; b represents an integer of 0 or 1 to 2].
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