发明名称 |
ELEKTRONISCHE VORRICHTUNG MIT WEGWERFCHIP UND VERFAHREN ZU DEREN HERSTELLUNG |
摘要 |
An electronic chip device includes an interface support film having a support film and at least one flat conductive interface placed on the support film, as well as a microcircuit connected to the interface. The interface support film possesses such properties that it can be creased or folded on itself without deterioration. The support film possesses a thickness of less than 75 mum, the best results being obtained with a thickness of between 10 mum and 30 mum. Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In one embodiment, the device includes a compensation film placed on the support film. The compensation film has a recess containing the microcircuit and its connections. The recess can contain a material to encapsulate the microcircuit and its connections. |
申请公布号 |
DE69806515(D1) |
申请公布日期 |
2002.08.14 |
申请号 |
DE1998606515 |
申请日期 |
1998.09.23 |
申请人 |
GEMPLUS, GEMENOS |
发明人 |
BLANC, RENE-PAUL;DESOUTTER, ISABELLE;GARNIER, PIERRE;MARTIN, PHILIPPE |
分类号 |
B42D15/10;G06K19/02;G06K19/07;G06K19/077 |
主分类号 |
B42D15/10 |
代理机构 |
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地址 |
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