发明名称 |
COMMUNICATION PIPE GUIDE PANEL AND FLOOR HEATING PANEL |
摘要 |
PROBLEM TO BE SOLVED: To provide (1) a communication pipe guide panel in which the communication pipe can be arranged in response to various embodiments without preparing a large number of members when a thermal medium control segment and a header are connected by the communication pipe and (2) a floor heating panel having the communication pipe guide panel installed therein. SOLUTION: The communication pipe guide panel is used for guiding a communication pipe connected to a thermal medium control segment toward a header. Grooves for burying the communication pipe are formed in a surface of the communication pipe guide panel in such a manner as to be collected at a header communication pipe connecting part from a plurality of different directions to communicate with each other. The floor heating panel is provided with the communication pipe guide panel.
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申请公布号 |
JP2002228168(A) |
申请公布日期 |
2002.08.14 |
申请号 |
JP20010026962 |
申请日期 |
2001.02.02 |
申请人 |
TOKYO GAS CO LTD;MITSUBISHI KAGAKU SANSHI CORP |
发明人 |
NISHIDA SUKETOSHI;INOUE NORIAKI |
分类号 |
E04F15/18;F24D3/10;F24D3/16;F24D19/00;F24D19/02;(IPC1-7):F24D3/16 |
主分类号 |
E04F15/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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