发明名称 COMMUNICATION PIPE GUIDE PANEL AND FLOOR HEATING PANEL
摘要 PROBLEM TO BE SOLVED: To provide (1) a communication pipe guide panel in which the communication pipe can be arranged in response to various embodiments without preparing a large number of members when a thermal medium control segment and a header are connected by the communication pipe and (2) a floor heating panel having the communication pipe guide panel installed therein. SOLUTION: The communication pipe guide panel is used for guiding a communication pipe connected to a thermal medium control segment toward a header. Grooves for burying the communication pipe are formed in a surface of the communication pipe guide panel in such a manner as to be collected at a header communication pipe connecting part from a plurality of different directions to communicate with each other. The floor heating panel is provided with the communication pipe guide panel.
申请公布号 JP2002228168(A) 申请公布日期 2002.08.14
申请号 JP20010026962 申请日期 2001.02.02
申请人 TOKYO GAS CO LTD;MITSUBISHI KAGAKU SANSHI CORP 发明人 NISHIDA SUKETOSHI;INOUE NORIAKI
分类号 E04F15/18;F24D3/10;F24D3/16;F24D19/00;F24D19/02;(IPC1-7):F24D3/16 主分类号 E04F15/18
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