发明名称 |
Semiconductor wafer production used in electronic devices comprises removing wafers from crystal piece using wire cutter, and placing wafers in trays |
摘要 |
<p>The production of semiconductor wafers comprises removing the wafers from a crystal piece using a wire cutter; and placing the wafers in trays. Preferred Features: The wafers are pre-cleaned by immersing in a liquid cleaning agent. The wafers are investigated for their geometry and surface properties using a measuring device.</p> |
申请公布号 |
DE10210021(A1) |
申请公布日期 |
2002.08.14 |
申请号 |
DE2002110021 |
申请日期 |
2002.03.07 |
申请人 |
WACKER SILTRONIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN AG |
发明人 |
HUBER, ANTON;JUNGE, JOACHIM;HEILMAIER, ALEXANDER |
分类号 |
C30B33/00;H01L21/00;H01L21/304;(IPC1-7):C30B33/00;B28D1/02 |
主分类号 |
C30B33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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