发明名称 Semiconductor wafer production used in electronic devices comprises removing wafers from crystal piece using wire cutter, and placing wafers in trays
摘要 <p>The production of semiconductor wafers comprises removing the wafers from a crystal piece using a wire cutter; and placing the wafers in trays. Preferred Features: The wafers are pre-cleaned by immersing in a liquid cleaning agent. The wafers are investigated for their geometry and surface properties using a measuring device.</p>
申请公布号 DE10210021(A1) 申请公布日期 2002.08.14
申请号 DE2002110021 申请日期 2002.03.07
申请人 WACKER SILTRONIC GESELLSCHAFT FUER HALBLEITERMATERIALIEN AG 发明人 HUBER, ANTON;JUNGE, JOACHIM;HEILMAIER, ALEXANDER
分类号 C30B33/00;H01L21/00;H01L21/304;(IPC1-7):C30B33/00;B28D1/02 主分类号 C30B33/00
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