POSITIVE TYPE RESIST COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a resist material having satisfactory resolving power and heat resistance even in ordinary pattern formation, capable of making pattern size smaller only by a proper flow baking temperature and having a proper flow speed, easily controllable the flow volume and rectangular profile when a semiconductor device is produced. SOLUTION: The positive type resist composition contains (a) an acid decomposable resin having solubility in an alkali developing solution increased by the action of an acid and (b) a photo-acid generating agent and the resin (a) comprises a resin A and a resin B satisfying the following characteristics; (the glass transition temperature of the resin A)>(the glass transition temperature of the resin B) before acid decomposition and (the glass transition temperature of the resin A)<(the glass transition temperature of the resin B) after acid decomposition.