发明名称 CURING PROMOTER FOR THERMOSETTING RESIN AND THERMOSETTING RESIN COMPOSITION CONTAINING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition exhibiting a high curing promotion effect only at >=a temperature range in molding, not promoting a curing reaction in a low-temperature range, having excellent shelf stability at a room temperature. SOLUTION: This curing promoter for a thermosetting resin comprises a compound represented by general formula (1) (P is a phosphorus atom; R1 to R4 may be the same or different and are each an aromatic ring-containing or a heterocycle-containing monofunctional organic group or a monofunctional aliphatic group in which a phosphorus atom and each substituent group form a phosphorus-carbon bond; Ti is a titanium atom; at least one of R5 to R9 is a group obtained by releasing of a proton from a proton donor having at least one proton to be released to the outside of a molecule and the rest of the groups are selected from a group forming a titanium-carbon bond, a titanium-oxygen bond or a titanium-nitrogen bond, hydrogen and a halogen; R5 to R9 may be the same or difference).
申请公布号 JP2002226493(A) 申请公布日期 2002.08.14
申请号 JP20010276351 申请日期 2001.09.12
申请人 SUMITOMO BAKELITE CO LTD 发明人 OKUBO AKIKO;GO YOSHIYUKI
分类号 C07F7/28;C07F9/54;C08G59/62;(IPC1-7):C07F9/54 主分类号 C07F7/28
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