| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum pump capable of suppressing deterioration of is components caused by its temperature rise. SOLUTION: A thermal nonconductor is disposed on the surface of a flange formed at the inlet of a vacuum pump to be bonded to a piping, and the vacuum pump is connected to a container to be exhausted through the nonconductor. Thereby, heat flowing into the vacuum pump by conducting on the piping connected to the inlet can be insulated, and the temperature of the pump can be suppressed. In addition, the inlet of the vacuum pump is bonded to the piping of the container to be exhausted through a member having high heat conductivity, and heat insulating effect can be further enhanced by cooling the member having high heat conductivity by water cooling or air cooling. |
