| 摘要 |
<p>PURPOSE:To fully automate the fabrication of a diode chip or the like by containing and conveying divided semiconductor chips while regularly aligning the chips to eliminate the necessity of checking or realigning the aligned chips by a manual work. CONSTITUTION:A semiconductor wafer 2 is adhered via wax 3 on a supporting plate 1, and divided into independent chips 2a-2e. Then, the recesses 4a-4c of a transparent retainer tool 4 having holes at the bottom as formed responsive to the chips 2a-2e are so brought oppositely into contact at the recesses 4a-4c with the chips 2a-2e, respectively. Thereafter, the wax 3 is molten and removed in this contacted state to accommodate the respective chips in the recesses for holding the separated chips.</p> |
